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Prototype Circuit Board Fabrication

High Layers PCB

Prototype Circuit Board Fabrication

Layers: 12

Thickness: 2.4 mm

PCB size: 152*128mm

Materials: FR4

Soldermask: Green

Surface finish: Immersion Gold

Trace width/space: 4/4 mil

Application: Communication System

  • Product Detail

Product Detail:

With our comprehensive strength in PCB manufacturing, Hecheng Fast Electronic Technology promptly provides low-cost, high-reliability high-level PCBs from our domestic and foreign production bases. By supporting fine pitches with high alignment accuracy technology and applying multi-layer stacked HDI technology using laser vias and filling plating, Hecheng Fast Electronic Technology has realized a multi-layer substrate structure with a high degree of wiring freedom. In addition, we have achieved a reduction in the number of layers and costs through tailor-made services from PCB design to implementation.


Benefits of high layers PCB

• High-density PCB with narrow pitch pattern and Vias with high-aspect ratio.

• Best design rule for customers’ low-loss transmission requirements.

• High Tg PCB for Pb free mounting, application requirements, etc.

Design Rule

High-speed transmission: Transmission-loss improvement

• Wide range of optimal low loss materials.

• Over 50Gbps signal transmission throughout the board.

• Chemical bonding technology to minimize the transmission loss

due to skin effect at high frequency.

High speed transmission: Reflection loss minimization

• Best structure to minimize reflection noise without open stub.

• Hybrid layer configuration composed of high density wiring layer and high speed low-loss transmission layer.

• Optimal design rules and layer structure at the early stage of PCB design.

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